Senior Principal System Architect(Rack level)

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Skills you'll use

What you'll do

• System & Topology Architecture 
• Chassis & Rack Definition: Lead the structural, electrical, and logical design of the UALink switch chassis, defining high-speed backplane topologies, cabled scale-up fabrics, and multi-tier switch hierarchies. 
• Signal & Power Integrity Collaboration: Partner with electrical and SI/PI engineering teams to define parameters for ultra-high-speed SerDes routing across PCBs, flyover cables, and optical components, minimizing bit error rates (BER). 
• Scale-Up Fabric Optimization: Architect rack-level and row-level topologies that optimize collective communication paths (e.g., All-Reduce, All-to-All) for tens of thousands of interconnected GPUs. 
• Platform Management & Software Infrastructure 
• Control Plane & BMC Architecture: Architect the end-to-end system management plane. Define how Baseboard Management Controllers (BMCs) monitor, configure, and provision the switch using OpenBMC, Redfish, and PLDM over MCTP. 
• Boot & Initialization Flows: Establish platform-level boot sequencing, multi-rail power sequencing, and secure multi-node firmware update orchestration. 
• Platform Security Architecture: Define the hardware security lifecycle, including Platform Firmware Resiliency (NIST SP 800-193), secure enclave integration, and Component Attestation (SPDM). 
• Advanced RAS & Infrastructure Integration 
• Platform-Level RAS: Architect system-level Reliability, Availability, and Serviceability (RAS) strategies. Define how the platform isolates hardware faults, routes around failed links, handles hot-swapping of fans, power supplies, and switch blades without dropping the AI training cluster. 

Who can apply

• Advanced RAS & Infrastructure Integration 
• Platform-Level RAS: Architect system-level Reliability, Availability, and Serviceability (RAS) strategies. Define how the platform isolates hardware faults, routes around failed links, handles hot-swapping of fans, power supplies, and switch blades without dropping the AI training cluster. 
• Thermal & Power Orchestration: Establish dynamic power management and telemetry frameworks to balance the massive transient power draws of next-generation AI workloads against rack-level cooling limits. 
• Degree: Master’s or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or a related field. 
• Experience: 20+ years of architectural experience in high-performance server platforms, hyper-scale network switches, or data center infrastructure. 
• System-Level Interconnects: Expert knowledge of high-speed platform fabrics and standards (UALink, NVLink, OAM/UBB, PCIe Gen6/Gen7, CXL, or Ultra Ethernet). 
• Platform Management Standards: Deep expertise in industry-standard management architectures, including Redfish, IPMI, MCTP, SPDM, and OpenBMC. 
• Hardware-Software Interface: Thorough understanding of OS/VMM kernels, device drivers, and platform initialization frameworks (UEFI, ACPI). 

About Renesas Electronics

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