Senior Engineer/ Engineer – Package Silicon Integration Engineer

About this role

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Skills you'll use

What you'll do

• Technology Integration
• Understand silicon and package technology roadmaps across market segments and identify integration solutions that address business needs.
• Develop and execute plans to integrate new silicon technologies with new package platforms for memory applications, with a focus on identifying and resolving CPI issues.
• Guide technology development through various maturity phases, supporting Micron's goals of technology leadership and manufacturing excellence.
• Virtual Prototyping & Simulation Support
• Contribute to virtual prototyping and artificial intelligence workflows that evaluate new materials, structures, and integration schemes before committing to physical builds — reducing time-to-learning and build costs.
• Apply or develop working knowledge of multi-physics simulation (mechanical, thermal, or electrical) to support CPI risk assessment and integration decisions.
• Use virtual prototyping insights to inform test vehicle scope, helping to down-select build options and focus empirical effort on highest-risk scenarios.
• Correlate simulation outputs with physical characterization, package build data, and reliability results to improve predictive confidence — with support from dedicated simulation specialists where needed.
• Characterization & Qualification

Who can apply

• Understanding of IC package development with exposure to CPI concepts, test vehicle development, front-end fab processes, or BEOL integration.
• Ability to define and execute test vehicle strategies that efficiently characterize integration behaviors and accelerate technology maturity.
• Familiarity with virtual prototyping concepts and the use of simulation to reduce physical build dependency is a strong plus.
• Familiarity with at least one simulation or modeling domain is advantageous but not required:
• Mechanical stress / thermo-mechanical analysis (FEA)
• Thermal simulation
• Electrical / signal integrity / power integrity modeling
• Background in fab metallization, BEOL (Back End of Line) integration, or front-end fab interactions is preferred.
• Ability in translating test vehicle and simulation data into DOE decisions and design rules.
• Experience with cross-functional project coordination and technical collaboration across global teams.

About Micron

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