IC Package Development Engineer

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Skills you'll use

What you'll do

• Package Development & Engineering
• Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments.
• Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems.
• Support development activities for memory and semiconductor package technologies from concept through qualification and manufacturing readiness.
• Analyze engineering data, identify risks, document findings, and recommend technically sound actions.
• Contribute to design-for-manufacturing, design-for-reliability, design quality, and first-pass qualification objectives.
• Design, CAD & EDA
• Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, design inputs, and engineering deliverables.
• Use CAD/EDA tools to support physical design, routing, logical design, design-rule validation, documentation, and release activities.
• Work with multidisciplinary teams to resolve design, manufacturability, performance, and data-quality issues.

Who can apply

• Bachelor's or master's degree in mechanical engineering, Electrical Engineering, Electronics Engineering, Mechatronics, Materials Engineering, Semiconductor Engineering, Computer Science, Data Science, or a closely related discipline.
• Strong foundation in engineering mathematics, physics, problem solving, and data interpretation.
• Ability to learn semiconductor packaging concepts, design methods, manufacturing processes, and engineering systems.
• Programming or scripting exposure in Python, MATLAB, C/C++, or equivalent language.
• Ability to communicate clearly, collaborate across functions, and manage assigned work with discipline.

About Micron

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