
Mechanical Design Intern at Tessolve Semiconductor
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- Vacancies
- 6,715
- Last date to apply
- 21 Jul 2026
- Salary starting from
- ₹48,480 / month
Prelims on 22–23 Aug 2026 · Graduates in any discipline are eligible · Approx. in-hand ₹57,000 – ₹60,000 in-hand.
View Full Details & ApplyAbout this internship
Skills you'll use
What you'll do
- Create and revise CAD models and drawings.
- Apply GD&T and design standards correctly.
- Support design reviews and prototype builds.
- Maintain drawing revisions and documentation.
- Document your work so the next person can pick it up
Who can apply
- Education: pursuing or completed B.E./B.Tech in Mechanical, Production or a related discipline
- Graduation year: 2025, 2026 or 2027 batch
- Minimum 60% / 6.0 CGPA (relaxable for candidates with strong practical projects)
- Technical skills: working knowledge of AutoCAD, SolidWorks, CATIA, GD&T
- Soft skills: clear written communication, ownership, willingness to document work
- Experience: none required — freshers welcome; prior projects or certifications are a plus
Perks & benefits
Interview & selection process
- 1The selection process for the Mechanical Design Intern role at Tessolve Semiconductor is merit-based and typically runs over 4 stages: Round 1: Application & Resume Screening — apply through this page; profiles are shortlisted on fundamentals, projects and role fit. Round 2: Online Assessment — aptitude plus role-specific questions covering AutoCAD, SolidWorks, CATIA. Round 3: Technical / Functional Interview — a discussion of your projects and practical scenarios covering AutoCAD, SolidWorks, CATIA, GD&T, Mechanical Design. Expect "how would you approach this?" rather than definitions. Round 4: HR Discussion — role expectations, stipend, start date, location and offer. Shortlisted candidates are contacted after applying. There are no charges at any stage of the process — Tessolve Semiconductor never asks candidates for money.
About Tessolve Semiconductor
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