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Tessolve Semiconductor logo — Tessolve Semiconductor Body in White (BIW) Design Intern at Tessolve Semiconductor
Tessolve Semiconductor

Body in White (BIW) Design Intern

InternshipHybridAurangabad, Maharashtra3 months32K/mo2 openingsImmediate / Rolling

About this internship

Tessolve Semiconductor is hiring a Body in White (BIW) Design Intern in Aurangabad — a hands-on, mentor-led internship built for students and 2026 freshers who want real exposure to automotive body engineering rather than a certificate-only programme. About the role As a Body in White (BIW) Design…

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Skills you'll use

CATIA V5Sheet Metal Stamping DesignWeldment PlanningGD&T StandardsDesign for Manufacturing (DFM)Tolerance Stack-Up AnalysisJoining Methods (Spot / MIG)2D Drawing & DetailingMaterial SelectionDesign Review Documentation

What you'll do

  • Work on designing sheet-metal parts and the joints that hold them together alongside the core team
  • Apply CATIA V5, Sheet Metal Stamping Design, Weldment Planning, GD&T Standards to live, production-facing problems
  • Document your work clearly for reviewers and stakeholders
  • Participate in reviews and act on the feedback you receive
  • Collaborate across engineering, product, design or business as required
  • Follow the team's quality, testing and documentation standards

Who can apply

  • Pursuing or recently completed B.E./B.Tech (Mechanical / Automobile / Production) or M.Tech (Design) — 2026 freshers & final-year students welcome
  • Working knowledge of CATIA V5, Sheet Metal Stamping Design, Weldment Planning (or a genuine willingness to learn them)
  • Strong fundamentals in your discipline and clear problem-solving ability
  • Care with detail and the discipline to document your work
  • Clear written and verbal communication in English
  • Based in or willing to work from Aurangabad, Maharashtra

Perks & benefits

Internship CertificateLetter of RecommendationMentorship from a named mentorLive project experienceExposure to professional tools and workflows

Interview & selection process

4 rounds — typical selection flow for this role:

  1. 1Application screening & resume shortlisting by the talent team
  2. 2Practical assignment or case study with a short walkthrough
  3. 3Discussion with the hiring manager on the role and your fit
  4. 4HR discussion — stipend, start date, expectations and offer

About Tessolve Semiconductor

Tessolve Semiconductor operates in the semiconductor engineering sector and has an active presence in Aurangabad. Interns here are put on real work from the start, because the team's view is that the fastest way to learn a craft is to practise it under people who already do it well — not to watch…
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